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Method and apparatus for imaging of features on a substrate
- Japan Patent Application Issued: 5451759
- US Patent Application Issued: 8,692,876
- South Africa Patent Application Issued: 2011/00120
- China Patent Application Issued: ZL200980127770.X
- Hong Kong Patent Application Issued: 1160273
Auguste Genovesio, Neil Emans
Stage of Development
Ready to Use
The invention relates to a method and an apparatus for the imaging of features on a substrate and in particular to a method and an apparatus for the imaging of spots on a micro array.
A method for imaging features on a substrate, comprising scanning the substrate and producing an image thereof, overlaying a grid model on the image, fitting the grid model to the locations of at least some of the features on the image, and extracting images of the features.
With a potential market as a research tool, this method is used for imaging features on a substrate comprises scanning the substrate and producing an image. The market for Microarray is expected to reach $7.4 billion by 2018.
The applications for this invention went national phase of international application PCT/EP2009/004951 which claims the benefit of US provisional application no 61/135,025. The patent applications were filed in US, Canada, Europe, Japan, China, Korea, Australia, South Africa and in Hong Kong. The applications in Japan, US, South Africa, China, and Hong Kong were issued on January 10 2014, on April 8 2014, on May 28 2014, on June 4 2014, and on August 15 2014 respectively.